二烯丙基雙酚A(O-DABPA)
發布時間：2023-07-09 21:36:53點擊:3764
產品詳細說明
分子式：C21H24O2 分子量：308.42 CAS NO：1745-89-7
結構式：
O-DABPA質量指標:
項 目 | 指 標 |
外 觀 | 無色或淡黃色液體 |
純 度 | ≥96% |
粘度（ cps ） | 600-1200 |
O-DABPA應用領域：
1. 主要用于雙馬來酰亞胺樹脂 (Bismaleimide 簡稱 BMI) 的改性，可大幅度降低 BMI 樹脂的應用成本，改善 BMI 樹脂的操作性和工藝性。提高 BMI 樹脂的韌性及耐熱性、成模性。可用于：①電器絕緣材料，覆銅線路板 , 耐高溫浸漬漆、絕緣漆層壓板、模壓塑料等。②耐磨材料、金剛石砂輪片、重負荷砂輪、剎車片、耐高溫軸承粘合劑等。③航空航天結構材料
O-DABPA 包裝、貯存：
1．桶裝：含量為25kg或200kg。
2．貯存于干燥、通風良好的庫房中，遠離熱源、火源，避免陽光照射。
Product Introduction
1.Introduction
CHEMICAL Name: ortho-diallyl bishenol A
Abbreviation: O-DABPA
Molecular formula:C21H24O2 Molecular weight:308.42 CAS NO:1745-89-7
Structure:
2.Technology Index
Items | Index |
Appearance | Colorless or yellowish liquid |
Purity % min | ≥96.0% |
Viscosity ( cps ) | 600-1200 |
Application:
It is principally used in the modifier of Bismaleimide(BMI). It can reduce the applying cost of BMI resin greatly, improve its operation and techics, and improve its tenacity, heat-resistance and model forming. BMI can be used in 1).electrical insulation materials,insulated lacquer, high temperature resistant varnish of circuit board with copper coated, layered board, model plastic etc. 2).friction-resistant material, diamond grinding wheel, heavy-burdened grinding wheel, brake slice, high temperature resistant adhesive of axletree etc. 3).transverse spaceflight configurable material. 4).functional material.
As an age-resistance of rubber, it can improve its age-resistance greatly with 1-3% BBA added.
Diallyl bisphenol A / Diallyl ether of bisphenol A is a kind of modified monomer of thermosetting resin which is mainly used in the modifying and toughening of bismaleimide resin, epoxy resin, phenolic resin etc., it can enhance the toughness of thermosetting resin greatly .It also can be used as activity diluent of thermosetting resin, it is used in rubber, the adhension strength between metal can be further improved.
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